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December 28, 2012 AT 7:02 am

EE Bookshelf: Successful PCB Grounding with Mixed-Signal Chips

Thanks to Ian over at Dangerous Prototypes for the heads up on this app note from Maxim: Successful PCB Grounding with Mixed-Signal Chips.  Have a good GND plane and return path is critical for high speed or mixed signal layout, but it’s often overlooked, and there is precious little information out there that’s accessible to non-specialists.  It’s always nice to see app notes from manufacturers trying to make this somewhat opaque area of interest a bit clearer!


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2 Comments

  1. http://www.sigcon.com/Pubs/edn/bigbadbend.htm

    Right-angle bends in PC-board traces perform perfectly well in digital designs in speeds as fast as 2 Gbps. EDN 5/11/2000(by Howard Johnson)

    Alphabetical Index
    Please wait while this page loads… it’s huge.

    You might want to check out the articles on High Speed Digitial Design:

    All Publications © by Dr. Howard Johnson 1993 – 2012 except as noted.

    http://www.sigcon.com/Pubs/pubsAlpha.htm

    http://www.sigcon.com/Pubs/index.htm

    I learned about these publications from:

    http://forum.6502.org/viewtopic.php?p=17664#p17664

    (There is a lot of knowledge that the old timers have from users of obsolete technology.)

  2. I have all of Dr. Howard Johnson’s books and I’d love to make it to his (final!) course at Cambridge this summer. The books aren’t cheap, but it’s the cheapest expert information on the subject out there.

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