The new Raspberry Pi B Model B+ is here - Pick one up in the store and check our detailed guide!

August 13, 2012 AT 12:55 pm

Decapping ICs (removing epoxy packaging from chips to expose the dies)

Decapping ICs (removing epoxy packaging from chips to expose the dies) via HaD.

This blog will contain descriptions of some of my favorite workshop techniques and projects. The subject area will include everything from woodworking to electronics to machining and project design.

Read more.

Related

“D is for Diode” – Circuit Playground Episode 4 is out now! CLICK HERE TO WATCH!

Have an amazing project to share? Join the SHOW-AND-TELL every Wednesday night at 7:30pm ET on Google+ Hangouts.

Join us every Wednesday night at 8pm ET for Ask an Engineer!

Learn resistor values with Mho’s Resistance or get the best electronics calculator for engineers “Circuit Playground”Adafruit’s Apps!



No Comments

No comments yet.

Sorry, the comment form is closed at this time.