August 13, 2012 AT 12:55 pm

Decapping ICs (removing epoxy packaging from chips to expose the dies)

Decapping ICs (removing epoxy packaging from chips to expose the dies) via HaD.

This blog will contain descriptions of some of my favorite workshop techniques and projects. The subject area will include everything from woodworking to electronics to machining and project design.

Read more.

Related

No Comments

No comments yet.

Sorry, the comment form is closed at this time.